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World’s First Ten-layer-laminated Three Dimensional LSI
Developed
A research team led by Prof. Mitsumasa Koyanagi, a
specialist in bio-robotics technology has succeeded in
developing a three dimensional laminated LSI named “Superchip”.
The invention of the “Superchip”, the world’s first of its
kind, gathered much attention when reported at The Institute
of Electrical and Electronics Engineers (IEEE) International
Electron Devices Meeting held in Washington D.C. on December
5-7, 2005.
In the newly developed “Superchip”, several chip layers
consisting of thin LSI chips, sensor chips and MEMs are
vertically stacked using a new self-organization method,
leading to the establishment of this unprecedented LSI
system, a totally new concept in LSI technology.
With conventional technology, it has been difficult to
integrate the different types of circuits and devices (such
as digital, analog, high-frequency as well as sensor
devices, MEMs devices and compound semiconductor circuit)
into one piece.
Prof. Koyanagi’s “Superchip” treats the small silicon LSI
chips, MEMs and compound semiconductor chips where these
circuits and devices are installed as system components to
produce a new system chip (“Superchip”) through
multi-layer-integration.
The new technology is adopted so that liquid droplets which
contain special agents can be applied to certain spots in
each chip and wafer to integrate different types of chips
into one system chip.
Self-organization between chips and wafers is produced by
utilizing the surface tensile force of liquid
droplets.
This method has never been thought of before in a
conventional LSI technology.
The innovation will make it possible to position more than
500 chips on 8 or 12 inch- silicon-wafer within 0.1 second
with an accuracy of 0.1um. Prof. Koyanagi’s team has also
succeeded in producing the first three dimensional
10-layer-memory LSI, each layer thickness of which is 30 um.
Contact:
Prof. Mitsumasa Koyanagi
Department of Bioengineering and Robotics
School
of Engineering
Tohoku
University
Tel: +81-22-795-6906 Fax: +81-22-795-6907
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